Our electronics assembly capability has been established for low to medium volume, complex, high quality assemblies. With staff trained in IPC-A-610E, including an in-house certified trainer, we plan to exceed customer expectations in highly demanding projects.
We offer express turnaround options as short as 24 hours (for a pre-kitted run) or 5 working days (with all parts and boards being supplied), for quick prototype or low volume production runs (1 to 100 pieces).
We utilise both Australian based and off-shore PCB manufacturers for differing quality, timing and cost requirements. All parts are procured from Authorised suppliers - no substitutions with cheap or low quality equivalents. Substitutions will only be made on agreement with our customers
Surface Mount and Through Hole Production
We have multiple pick and place machines, able to place down to 01005 or 0201 in size and with speeds of up to 34,000 components per hour. Through hole soldering is accomplished via CNC selective soldering - well suited for mixed technology designs with large connectors close to surface mount parts.
Our production process can cater to both Lead Free (RoHS) and Lead based assembly with 3 separate printing platforms.
Two reflow ovens - up to 8 zone - are able to meet any challenging board requirement. Calibrated KIC thermal profilers are used to tune specific temperature profiles to each board type.
Automated Optical Inspection (AOI)
Automated Optical Inspection (AOI) is utilised for both solder paste inspection and final solder inspection with components down to 01005 in size. A single board can be scanned and processed in a few seconds. Built in Statistical Process Controls can be used for barcode recording and yield tracking, monitoring defects, as well as for continual process improvement.
Automated X Ray Inspection (AXI)
In house X-ray processing is used for validation of Ball Grid Array (BGA) assembly, as well as voiding underneath leadless packages. Our system is rated 5 micron spot size and 100kV tube, and full motorised board positioning/tilting. Automatic inspection functions are available for production and batch use.
Board and Assembly Cleaning
Assembled and completed boards are washed in an environmentally friendly closed-loop cleaning system, nothing is discharged to the drain, and all wash and rinse water is recycled. Able to remove all types of flux, the average cycle time is 30 minutes. Board cleanliness is measured by resistivity - and monitored on a batch by batch basis.